The problem of dual component thin layer curing is a common phenomenon, with two main reasons: 1. During the adhesive application process, when the adhesive strip is very thin, the crosslinking agent in the colloid is easily evaporated, resulting in insufficient crosslinking agent; 2. Due to the low amount of catalyst used in the dual component silicone adhesive, the content of colloidal catalyst is lower after scraping, resulting in the inability to catalyze reaction backsticking.

There are two main methods to solve this problem: 1. increase the content of crosslinking agents, and 2. use crosslinking agents with lower activity and larger molecular weight, which can reduce volatilization and increase the content of catalysts.